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Trends Tag

Via-In-Pads Technology

Via-In-Pads technology has been around for a few years now, but nowadays it’s becoming one of the most discussed topics amongst PCB designers and PCB fabricators. Via-in-Pads (VIP) is a technology where plated through holes are filled with conductive or non-conductive epoxy ink, subsequently planarized and plated over. Via-In-Pads are usually patterned in to BGA and uBGA pads for the direct soldering.